Semiconductor Testing
21 Aug, 2026
For chips, PCB, connectors and wafers. High‑precision temperature‑humidity control simulates storage & service environment. Thermal shock checks package cracking. Walk‑in for batch aging; HALT accelerates early‑failure detection for semiconductors.
For chips, PCB, connectors and wafers. High‑precision temperature‑humidity control simulates storage & service environment. Thermal shock checks package cracking. Walk‑in for batch aging; HALT accelerates early‑failure detection for semiconductors.
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